发明名称 |
CONNECTING METHOD BY LASER |
摘要 |
<p>PROBLEM TO BE SOLVED: To prevent reduction of strength in a weld zone. SOLUTION: When a conductor 2 of a wiring member 1 that both sides of the conductor 2 are held with a coating material 3 is connected to a plate shaped terminal 5 of the mating side by welding using laser irradiation, at least one surface side of the conductor 2 in the wiring member 1 is exposed, the exposed zone to be welded is superposed on the plate shaped terminal 5 and a meltable material 10 is arranged in a laser irradiating side of the superposed part, the meltable material 10 is irradiated with laser beams, and connection is executed so that a weld zone 7 that the meltable material is filled in a recessed part or a through-hole 6 which is generated by laser irradiation is formed.</p> |
申请公布号 |
JP2000141029(A) |
申请公布日期 |
2000.05.23 |
申请号 |
JP19980313138 |
申请日期 |
1998.11.04 |
申请人 |
HARNESS SYST TECH RES LTD;SUMITOMO WIRING SYST LTD;SUMITOMO ELECTRIC IND LTD |
发明人 |
SAKA YOSHIFUMI;SAKATA TOMOYUKI |
分类号 |
B23K26/00;B23K1/00;B23K1/005;B23K26/20;B23K35/26;C22C13/00;H05K3/36;(IPC1-7):B23K1/005 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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