Method for cooling electronic devices using a flexible coolant conduit with slip on cold plates

摘要

To achieve the above-mentioned objects, and other related ones a method and apparatus for cooling of an electronic assembly is suggested. The electronic assembly is placed in thermal contact with a monolithic, non-jointed flexible coolant conduit housing a coolant. A plurality of cold plates are then slipped over the conduit, through their indentation like opening along a peripheral edge of each plate. The conduit with plates is then bend so as to complement the contour of the assembly to be cooled.