发明名称 |
METHOD AND APPARATUS FOR BUILDING JETTING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for building a jetting apparatus whereby a flexible film is prevented from being damaged because of a move in an alignment process and an assemble process and a total time for completely assembling an object is reduced. SOLUTION: A heating element wafer 100 with many heating elements 101 is fixed to a vacuum bench 201. Thereafter, a flexible film 20 formed as a separate part irrespectively of a manufacture process for a jetting element is aligned in a state with a predetermined distance spaced from the heating element wafer 100. After the flexible film 20 is fixed to an upper part of the heating element wafer 100, the heating element wafer 100 and flexible film 20 are bonded.
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申请公布号 |
JP2000141668(A) |
申请公布日期 |
2000.05.23 |
申请号 |
JP19990077330 |
申请日期 |
1999.03.23 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
AHN BYUNG-SUN;NIKOLAEVICH DUNAEV BORIS |
分类号 |
B41J2/045;B41J2/055;B41J2/14;B41J2/16;(IPC1-7):B41J2/16 |
主分类号 |
B41J2/045 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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