发明名称 Plasma process apparatus and plasma process method
摘要 In order to effect a plasma process at a high rate, such as formation of a high-quality deposit film having very uniform thickness and quality over a large-area substrate, (1) an oscillation frequency of an RF generator is used in the range of 30 to 600 MHz, (2) a matching circuit and a cathode electrode are connected through a transmission line and RF power is supplied through the transmission line, (3) the cathode electrode is of an electrically conductive structure of a rod shape and at a connection part between the cathode electrode and an inner conductor of the transmission line, an external shape of a cross section of the cathode electrode is the same as an external shape of a cross section of the inner conductor, and (4) at least the connection part between the cathode electrode and the inner conductor of the transmission line is covered by a dielectric member having the same external shape as an external shape of a transmission medium in the cross section of the transmission line.
申请公布号 US6065425(A) 申请公布日期 2000.05.23
申请号 US19980120319 申请日期 1998.07.22
申请人 CANON KABUSHIKI KAISHA 发明人 TAKAKI, SATOSHI;YAMAGAMI, ATSUSHI
分类号 C23C16/24;C23C16/509;H01J37/32;(IPC1-7):C23C16/00 主分类号 C23C16/24
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