发明名称 COVERED WIRE CONNECTION METHOD AND STRUCTURE
摘要 Two covered wires conductively connected are overlapped with each other at connection portions. The overlapped connection portions are pinched by a pair of resin chips. By melting cover portions and pressing resin chips from outside, the conductive wire portions of the covered wires are conductively contacted with each other at the connection portions. The pair of the resin chips are melt-fixed to each other to seal the connection portions. A crossing angle .theta. of the two covered wires at the connection portion is set to not less than 45.degree. to not greater than 135.degree.. Thus, the covered wires can be conductively connected with each other at cheap price easily. Further, a connecting state having an excellent electrical characteristic can be obtained stably.
申请公布号 CA2217146(C) 申请公布日期 2000.05.23
申请号 CA19972217146 申请日期 1997.10.01
申请人 YAZAKI CORPORATION 发明人 IDE, TETSURO;ASAKURA, NOBUYUKI
分类号 H01R4/70;H01R43/02;(IPC1-7):H01R43/00;H01R4/00 主分类号 H01R4/70
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