| 摘要 |
A heatsink (13) for dissipating heat from a heat-generating source such as an electronic component (30) includes a plurality of heatsink plates (10), wherein the individual heatsink plates (10) are bound together at a binding portion thereof so as to form a heat-absorbing portion for contacting a heat-dissipating surface of the electronic component, and portions of the heatsink plates (10) opposite the heat-absorbing surface (12) are separated from each other to collectively act as a heat-dissipating portion and a binder for binding the plurality of heatsink plates (10) together. To provide the separation between heat-dissipating portions of the heatsink plates (10), the heatsink (13) includes a plurality of spacers each interposed between the binding portions of neighboring heatsink plates (10) or the heatsink plates (10) are spread out apart from each other by being bent at predetermined angles. The heatsink plates (10) are formed of a plurality of fins (15) spaced apart from each other by a predetermined interval. The binder is preferably a rivet (17). In manufacturing the heatsink (13), a protrusion is formed at the individual heatsink plates (10) such that the heat dissipating portion of the heatsink is unfolded outward at a predetermined angle by the protrusion. The heatsink (13) can transfer the heat generated from a heat-generating source into the surrounding air, without power consumption and without generation of noise and vibrations, and such a heatsink can easily be manufactured by the apparatus and method. |
