| 摘要 |
A foldable electronic circuit is manufactured on a flexible substrate (14), such as a steel foil or a plastic foil, and the circuit (12) is encapsulated with layer (10) of appropriate thickness. The circuit thereby lies in the neutral plane of the composite substrate and encapsulated circuit structure. When the composite structure is bent or flexed, minimal stress is exerted on the circuit, as the circuit is positioned in the neutral plane. Generally, the closer the circuit is located to the mechanical center of the composite structure, i.e. closer to the neutral plane, the more flexible the circuit structure is. |
