METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT WITH WIRING PARTLY EXTENDING IN THE SUBSTRATE AND SEMICONDUCTOR COMPONENT PRODUCED ACCORDING TO SAID METHOD

摘要

The invention relates to a method for producing a wiring extending at least partly in a substrate, according to which at least one conductive connection extending in the semiconductor substrate and at least one conductive connection extending on the semiconductor substrate are provided for. The semiconductor component provided for in the invention permits applications requiring a high degree of security against external manipulation.