| 摘要 |
The invention provides a high density integrated circuit (IC) in which there are a plurality of circuit layers integrated in one chip in vertical direction. Each of said circuit layers has one certain independent memory, logic and/or analog function. Among these layers, a plurality of vias are provided to connect these different layers. Also, the invention provides an improved high density IC including a memory and a wiring divided area for wiring. With a buffer, the operating speed can be increased. With a field programmable memory array as a redundant array, the product yield can be raised.
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