POLISHING PAD AND POLISHING DEVICE

摘要

A polishing pad characterized by comprising a polishing layer having a micro-rubber A hardness of at least 80 degrees and a cushion layer having a bulk modulus of at least 40 Mpa and a tensile elastic modulus of at least 0.1 Mpa and up to 20 Mpa; and a polishing device characterized in that a semiconductor substrate is fixed to a polishing head, the above polishing pad is fixed to a polishing surface plate with the polishing layer facing the semiconductor substrate, and one or both of the polishing head and the polishing surface plate are rotated to polish the semiconductor substrate. A polishing device or a polishing pad used in a mechanical flattening process for smoothing by polishing an insulation layer formed on a semiconductor substrate or the surface of a metal wiring, wherein technologies are provided for uniformly flattening the entire surface of a semiconductor substrate and polishing it uniformly up to a portion close to a wafer edge and for making uniformity and flatness compatible with each other at a high platen rotation speed.