Copper containing substituted phenylethylene precursor and synthesis method

摘要

There is provided a Cu(hfac) precursor with a phenylethylene carrying substituents selected from H, C1 to C6 alkyl, C1 to C6 haloalkyl, phenyl and C1 to C6 alkoxyl. alpha -Methylstyrene is the preferred ligand and the precursor containing it has proved to be stable at low temperature and sufficiently volatile at higher temperatures. Copper deposited from this precursor has low resistivity to high adhesive characteristics.