| 摘要 |
<p>A ceramic substrate chuck having a protective coating (100) and spacing mask (110) deposited upon a support surface (102) thereof and a method of fabricating same. The protective coating (100) is fabricated of a leaky dielectric material, such materials include oxides and nitrides such as Si3N4, SiO2, Si-O-N, BN, diamond, Al2O3, and aluminosilicates. The protective coating (100) and spacing mask (110) is formed upon the support surface (102) using one of a variety of material deposition techniques including chemical vapor deposition (CVD), plasma enhanced CVD, sputtering, flame spraying, and the like. Prior to deposition of the protective coating (100), a layer of the surface of the ceramic substrate support can be removed to reduce or prevent contaminants from being sealed between the support surface (102) and the protective coating (100). The protective coating (100) of the present invention results in a substantial decrease in contamination of ceramic chucks, wafers and the process chamber environment. The protective coating (100) does not significantly interfere with the clamping process or impact the clamping force that retains the wafer (112) upon the electrostatic chuck (104). <IMAGE></p> |
