发明名称 Method and apparatus for efficient conduction cooling of surface-mounted integrated circuits
摘要 A plurality of heat-conducting compressible button contacts (10) between a heatsink (28) and an electronic part, e.g., a printed wiring board (22) or integrated circuit (24), to be cooled. A thin plate (16) and/or indentations (44, 44') in the heatsink are preferably used to support the heat-conducting buttons. Each heat-conducting button contact is placed in compression, generally, for example, by the heatsink. A thermal path is thus provided between the part and the heatsink. Differently sized compressible button contacts are used to accommodate disparate heights between the heat sink and surfaces on components of the electronic part.
申请公布号 US6064573(A) 申请公布日期 2000.05.16
申请号 US19980127436 申请日期 1998.07.31
申请人 LITTON SYSTEMS, INC. 发明人 MORTON, JAMES R.
分类号 H01L23/433;(IPC1-7):H05K7/20 主分类号 H01L23/433
代理机构 代理人
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