| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a through hole without adjusting a metal mold or hole. SOLUTION: A process wherein a laminate A is provided by piling several green sheets 11a-11d provided with a specified via hole and wiring pattern and a process wherein a multilayer sintered material A' is provided by calcining the laminate A are contained. The laminate A contains the green sheets 11a-11d where a through hole 18 is formed at the stage of having been the multilayer sintered material A', and in the part being the bottom surface of the through hole 18, a process 15 to prevent the upper and lower green sheets 11a and 11b from sintering each other at calcining is performed between them, and, in the multilayer sintered material A', a cut to the bottom surface of the through hole 18 is made at the part being the outline of the hole, and a sintered material piece 17 in the hole part is bored out.</p> |
