发明名称 METHOD FOR FORMING TERMINAL ELECTRODE OF CERAMIC ELECTRONIC PARTS
摘要 <p>PROBLEM TO BE SOLVED: To prevent a sintering impediment due to residual carbon and prevent service deterioration of a ceramic element body by a method wherein, after an end part of a ceramic base body having an internal electrode is coated with a paint containing a conductive component and an organic binder, and is heated and reduced in the reduction atmosphere, it is heated and burnt in the neutral atmosphere. SOLUTION: An end part of a ceramic base body 1 having an internal electrode 3 is coated with a paint containing a conductive component of which a staple component is metal powders and an organic binder. Next, it is heated for eliminating the organic binder included in a coated coating film 2. Next, a ceramic electronic parts element is placed and reduced in the reduction atmosphere. Preferable temperature conditions of the reduction process are 300 to 600 deg.C. Next, the ceramic electronic parts element is heated and burnt in the neutral atmosphere. According to the burning process, a terminal electrode 2 of a minute structure superior in electric characteristics is obtained. Thereafter, a nickel electrolytic plating layer and Sn or its alloy electrolytic plating layer are formed on the electronic electrode 2 by a barrel plating device, etc.</p>
申请公布号 JP2000138128(A) 申请公布日期 2000.05.16
申请号 JP19980311427 申请日期 1998.10.30
申请人 TDK CORP 发明人 SASAKI AKIRA;KIN SHINTARO;MARUNO TETSUJI;SASAKI SHINICHI
分类号 H01G4/12;H01G4/232;H01G4/30;H01G13/00;(IPC1-7):H01G4/12 主分类号 H01G4/12
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