| 摘要 |
PROBLEM TO BE SOLVED: To test performance of produced module ICs at the specified temperature and improve reliability of shipped products. SOLUTION: This carrier is provided with a housing 12, a pair of fitting plates 14 which are formed in parallel within the housing space of the housing 12 and are provided with guide grooves 21, a plurality of rotary bodies 16 which are fitted to the fitting plate 14 elastically and come in contact or release in accordance with rotation to hold a module IC, and a spring member to give a restoring force to the rotary bodies 16. |
