| 摘要 |
PROBLEM TO BE SOLVED: To enhance operating rate of the entire line for any number of sheets of wafer to be manufactured and to enhance productivity, even in case of small quantity variety production by additionally providing a function for replacing a wafer between carries in an atmosphere, where contamination is controlled with respect to the wafer. SOLUTION: A spot which is carried by an overhead shuttle 100 is shifted to the side of an upper layer by means of the up/down mechanism of the overhead shuttle. It is received by a wafer container arm 101 which is movable along a stocker, and a wafer container 124 is moved above a sealing part 106. When the wafer container 124 is set at the sealing part 106 and fixed in the place, a sequence for breaking the low vacuum in the wafer container is actuated. When the inner pressures of a lower layer 122 and the wafer container 124 are equalized, the sealing part 106 is lowered integrally with a wafer carrier and a wafer 140 is stocked in a clean dry air atmosphere. Reverse procedure followed, when the carrier is contained in the wafer container. |
