发明名称 CONVERSION MODULE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a conversion module, which is comparatively simple to manufacture, despite the connection reliability of the module with the side of a motherboard being superior. SOLUTION: This conversion module 1 is provided with a conversion board 3, having an element 9 for performing a signal conversion or the like and a plurality of socket pins 24. With the socket pins 24 provided on the upper surface of the board 3, a plurality of terminals 26 provided on the lower surface of a grid array 2 are provided in a state in which the terminals 26 are detachable with respect to the pins 24. The pins 24 are penetratingly inserted in pin insert/draw-out holes 5 provided in the board 3. The points of the pins 24 are protruded from the side of the lower surface of the board 3 as much as the length capable of insert/draw out the pins 24 in or from the holes 5. Accordingly, it becomes possible to connect electrically the module 1 with the side of the motherboard MB via a socket 41 for PGA(pin grid array) having pin insert/ draw-out holes 44.
申请公布号 JP2000138327(A) 申请公布日期 2000.05.16
申请号 JP19980309116 申请日期 1998.10.29
申请人 IBIDEN CO LTD 发明人 NAGAYA KUNIO;HAYASHI HIROAKI
分类号 H01L23/32;H01L25/10;H01L25/11;H01L25/18;(IPC1-7):H01L23/32 主分类号 H01L23/32
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