Method of manufacturing molded baked snacks

摘要

PCT No. PCT/JP97/04167 Sec. 371 Date Jul. 15, 1998 Sec. 102(e) Date Jul. 15, 1998 PCT Filed Nov. 14, 1997 PCT Pub. No. WO98/21969 PCT Pub. Date May 28, 1998Using a metal mold (8) having an insulating section provided with vapor release sections, pressure outside the metal mold (8) is reduced, and heating is performed while releasing vapor produced thereby through the vapor release sections. This can prevent insulation breakdown caused by condensation of large amounts of vapor produced by ingredients during molding and heating of molded baked snacks by means of resistance heating, dielectric heating, etc.