发明名称 HIGH VOLTAGE RESISTANT INTERLAYER-INSULATING FILM MATERIAL FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a negative type silicone ladder resin composition having a low stress property and capable of forming a thick film by including a specific resin and a photosensitive cross-linking agent or a photopolymerization initiator. SOLUTION: This high voltage resistant interlayer-insulating film material composition for a semiconductor is obtained by including (A) a silicone ladder resin having >=1,000 weight-average molecular weight, of the formula [R1, R2 are each an aryl, H, an aliphatic alkyl or a functional group having an unsaturated bond; R3 to R6 are each H, an aryl, an aliphatic alkyl, a trialkylsilyl or a functional group having an unsaturated group; (n) is an integer], and capable of forming a thick film by increasing a ratio of a long chain alkyl group or an aryl group introduced into the R1 and R2 of its side chain, and (B) a photosensitive cross-linking agent or a photopolymerization initiator. The above composition can be used as an interlayer-insulating film, etc., for maintaining the voltage resistant insulation of a semiconductor element such as a power IC, etc., loaded in a high voltage resistant motor.
申请公布号 JP2000136223(A) 申请公布日期 2000.05.16
申请号 JP19980311882 申请日期 1998.11.02
申请人 MITSUBISHI ELECTRIC CORP 发明人 YASUDA NAOKI;YAMAMOTO SHIGEYUKI;AKIYAMA HAJIME
分类号 H01L21/312;C08F2/50;C08F299/08;C08L83/07;(IPC1-7):C08F299/08 主分类号 H01L21/312
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