| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor-sealed device which has improved adhesive power between a frame preplated especially with Pd, Pd-Au, etc., and a resin composition, having improved reflowing resistance and prevents the deterioration of moisture resistance after reflow. SOLUTION: This resin composition for sealing contains (A) an epoxy resin, (B) a novolak type phenolic resin, (C) bis(3-triethoxysilylpropyl) tetrasulfide and (D) an inorganic filler as essential components. Therein, the bis(3- triethoxysilylpropyl) tetrasulfide C and the inorganic filler D are contained in amounts of 0.01-1.0 wt.% and 25-95 wt.%, respectively, based on the total amount of the resin composition. The semiconductor-sealed device is obtained by sealing a semiconductor chip with the composition.
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