发明名称 CHIP TYPE ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a chip type electrode component generating no exfoliation on the connected and fixed part where temperature is suddenly changed, when a terminal electrode having a conductive resin layer as a chip type electronic component which is intensive to thermal change is fixed to a printed wiring. SOLUTION: The terminal electrodes 5 and 6, formed on both ends of a ceramic substrate, form a laminated structure and have the second electrode layer 8 consisting of conductive resin, a gold or copper film is formed on the third electrode layer 9 which is the surface layer of the terminal electrode, and a printed wiring substrate is connected and fixed by a conductive resin bonding agent in this chip type electronic component. A conductive resin layer is contained in the terminal electrodes 5 and 6, and an excellent characteristic electronic component, which resists to a severe temperature change, can be obtained by forming a gold or copper-plated layer on the surface of the terminal electrodes 5 and 6 containing a conductive resin layer.
申请公布号 JP2000138131(A) 申请公布日期 2000.05.16
申请号 JP19980311647 申请日期 1998.11.02
申请人 KYOCERA CORP 发明人 IEMURA TSUTOMU
分类号 H01G2/06;H01G4/228;H05K1/18;(IPC1-7):H01G4/228 主分类号 H01G2/06
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