发明名称 |
IC socket for IC package |
摘要 |
In an IC socket in which IC leads of an IC package are pressed down by a presser member so as to be contacted with and retained by contacts arranged on the socket, an IC socket for an IC package comprises an IC mount which is upwardly and downwardly movably interposed between the socket and the presser member. The IC mount is formed with through-holes or through-grooves, and the contacts each having a vertical slit are inserted into the through-holes or through-grooves. The IC leads of the IC package placed on the IC mount are pressed down together with the IC mount by the presser member such that distal end portions of the contacts are relatively protruded upwardly from the through-holes of the IC mount as the IC leads are pressed down, so that the IC leads are pushed into the vertical slits.
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申请公布号 |
US6062874(A) |
申请公布日期 |
2000.05.16 |
申请号 |
US19980149130 |
申请日期 |
1998.09.08 |
申请人 |
YAMAICHI ELECTRONICS CO., LTD. |
发明人 |
MATSUDA, EIJI;SATO, SHIGERU;ISHII, YOSHIHARU |
分类号 |
H01R33/76;G01R31/26;H01L23/32;H05K7/10;(IPC1-7):H01R12/00 |
主分类号 |
H01R33/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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