发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition capable of being developed with high accuracy even with a dilute weak basic aqueous solution and able to form a hardened coating film having excellent water resistance or the like by compounding a specific pair of resins at least one of which has carboxy groups and a photo-acid generator. SOLUTION: This composition is obtained by compounding (A) a phenolic resin, (B) an epoxy resin and (C) a photo-acid generator when the component A and/or the component B contains COOH groups. For example, a COOH- containing novolak-type phenolic resin is preferably used as at least a part of the component A. Further as a COOH-containing component B, the following material or the like is preferably used, that is, a product prepared by adding an acid anhydride to a modified epoxy resin obtained by reacting an epoxy resin having two or more epoxy groups in a molecule with a compound having one or more functional groups capable of reacting with an epoxy group, and one or more alcoholic OH groups.
申请公布号 JP2000136230(A) 申请公布日期 2000.05.16
申请号 JP19990014828 申请日期 1999.01.22
申请人 NIPPON SHOKUBAI CO LTD 发明人 AWAJI TOSHIO;OTSUKI NOBUAKI;ARAKAWA MOTOHIRO;INOUE RIE
分类号 G03F7/023;C08G59/40;C08G59/62;C08L63/00;G03F7/032;G03F7/038 主分类号 G03F7/023
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