Housings for security devices

摘要

PCT No. PCT/EP97/04029 Sec. 371 Date Jan. 22, 1999 Sec. 102(e) Date Jan. 22, 1999 PCT Filed Jul. 24, 1997 PCT Pub. No. WO98/04625 PCT Pub. Date Feb. 5, 1998The use of a thermoplastic molding composition differing from ABS and comprising, based on a total of 100% by weight of amounts of components A and B, and, if desired, C and/or D, a: as component A, from 1 to 99% by weight, preferably from 15 to 60% by weight, in particular from 25 to 50% by weight, of a particulate emulsion polymer with a glass transition temperature of below 0 DEG C. and with a median particle size of from 50 to 1000 nm, preferably from 50 to 500 nm b: as component B, from 1 to 99% by weight, preferably from 40 to 85% by weight, in particular from 50 to 75% by weight, of at least one amorphous or partly crystalline polymer, c: as component C, from 0 to 50% by weight of polycarbonates, and d: as component D, from 0 to 50% by weight of fibrous or particulate fillers or mixtures of these for producing housings for security equipment.