| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, wherein positioning in mounting is easy and yield is improved and its manufacturing method, in the semiconduc tor device in which a semiconductor element, is mounted on a spacer facedown. SOLUTION: In this semiconductor device, a semiconductor element 10, which has a plurality of element electrodes 3, 4 on the same surface side of a semiconductor layer 2 arranged on a substrate 1, is mounted on a spacer 20 provided with a plurality of connecting electrodes 23, 24 corresponding to a plurality of the element electrodes 3, 4 on the same surface side, in such a manner that the element electrodes 3, 4 and the connecting electrodes 23, 24 face each other. The spacer 20 has at least one step-difference part 25. The semiconductor element 10 is mounted on the spacer 20, by making the side surface of the element 10 abut against the wall surface of the step-difference part 25.
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