| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size and weight of a semiconductor laser device as a whole by integrally enclosing a semiconductor laser element which oscillates in a single longitudinal mode when the element is driven with a direct current, and a high-frequency superposing circuit which drives the element by superposing a high-frequency current in the range of 100 MHz to 1 GHz upon the direct current in a metallic enclosure. SOLUTION: In a semiconductor laser device, a wiring board 4 is attached to the board attaching section 8 of an iron stem 1. On the wiring board 4, a semiconductor laser element 6 and a high-frequency superposing circuit which drives the element 6 and is composed of circuit parts 5 and 5' are mounted. After the board 4 is attached to the section 8, the board 4 is sealed by putting a cap 2 having a glass window 3 for transmitting the light beam from the element 6 on the upper surface of the board 4. |
