| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate processing device for preventing turbulence of the down air flow in a device, when a substrate to be processed is carried and for preventing decrease in yield, caused by the sticking of dust to the surface of the substrate. SOLUTION: A carrying path 31 is made at the center in a processing station 11, and various kinds of processing units are arranged on both sides of the carrying path 31. A down flow is formed in the carrying path 31 and wafer carrying mechanisms 32, 33 for making a wafer W horizontal, when the wafer W is carried into and out of the processing unit, and for carrying the wafer in a nearly vertical position at least temporarily, except when the wafer W is carried into and out of the processing unit.</p> |
