| 摘要 |
PROBLEM TO BE SOLVED: To protect a substrate against crackings or chippings and to prevent aggregations/projections due to solder climbing onto the upper surface of a semiconductor substrate by forming a step at the fringe of the substrate and jointing the substrate and a package through soldering. SOLUTION: A semiconductor substrate 1, having a circuit formed on the upper surface, is sliced into a thin film and an L-shaped step 5 is formed in the vertical cross-section of the substrate 1 in the outer circumferential region thereof, while a metal film 2 is formed on all surfaces other than the upper surface. The substrate 1 is jointed to the recess 9b of a package 9 via the metal film 2 by means of a solder 3. When the substrate 1 is mounted on the package 9, the solder 3 climbing from the side face part of the substrate 1 aggregates at the L-shaped step 5 to form a protrusion 6. Since the protrusion 6 of the solder 2 is wetted at the L-shaped step 5, it will not protrude, and the height thereof can be suppressed substantially equally to those of the substrate 1 and the package 9. Furthermore, outer circumferential part of the substrate can be prevented from being chipped and the like by the solder 3 aggregating at the step 5.
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