| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of manufacturing processes of a film carrier tape for TAB and provide the film carrier tape for TAB, which is superior in bending workability and corresponds to reduction of space and cost. SOLUTION: A reinforcing sheet 12 composed of polyamideimide resin is stuck on a base film 11 composed of polyimide resin film. After an adhesive layer 15 is formed on the base film 11, a device hole 14 and sprocket holes 13 are formed at prescribed positions. A copper foil is fixed thermally through thermocompression bonding and laminated on the surface of the adhesive layer 15 of the base film 11, except for the sprocket holes 13 and subjected to patterning treatment; and leads 16 are formed. Prepared resin coat material is spread and cured by heating, an over coat resin layer 17 is formed, and a film carrier tape for TAB with a reinforcing sheet is formed. Immediately prior to mounting process of an IC chip or the like, the reinforcing sheet 12 is peeled.
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