| 摘要 |
PROBLEM TO BE SOLVED: To set an angle with high resolution by a method wherein a rotary drive mechanism is controlled so as to balance a measurement value in both plus and minus directions of a rotary angle about an X axis and a Y axis of the rotary drive mechanism. SOLUTION: Linear scales 21, 21' for directly measuring an angleβof a wafer stage fitting plate 13 are fixed on a tilt stage base 20 by linear scale support rods 15, 15'. Furthermore, a linear scale for directly measuring an angleαis fixed on an X axis base plate by the linear scale support rod. By doing so each of the rotary anglesα,βof the wafer stage fitting plate 13 is directly measured, and each of the rotary anglesα,βis measured by a control mechanism 18 based on this measured angle, while a rotary drive mechanism 1 is controlled. Thus, it is possible to set an angle with high resolution and high precision. |
