| 摘要 |
PROBLEM TO BE SOLVED: To prevent defective wiring inexpensively through a convenient method by providing a solid organic material coating an electrode wiring pattern to expose the electrical joint thereof at least partially. SOLUTION: Entire surface of a substrate is coated with dry film resist 9 using a laminator while being heated, preferably, at about 100 deg.C in order to ensure adhesion. A cover film is stripped immediately after coating and a photomask etched with a specified pattern is applied in order to perform through a carrier film. After stripping the carrier film, development is performed and the dry film resist is left only in a desired area, i.e., only the bonding pads 4 of electrode wiring pattern is exposed. Since a wire bonded gold wire does not touch an electrode directly, problem of defective wiring can be eliminated.
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