发明名称 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a photoresist composition good in sensitivity and resolution and especially high in adhesion to substrate by incorporating a resin having 2 kinds of specified polymerization units and an acid generator. SOLUTION: The photoresist composition contains the polymer having polymerization units each represented by the formula derived from a monomer of 2-alkyl-2-adamantyl (meth)acrylate and further polymerization units selected from 3-hydroxy-1-adamantyl (meth)acrylate and (meth)acrylonitrile monomers, and the acid generator. In the formula, R1 is H atom or methyl group; and R2 is an alkyl group. This resin is a copolymer of a 30-80 mol% 2-alkyl-2- adamantyl (meth)acrylate monomer and 20-70 mol% monomer selected from 3-hydroxy-1-adamantyl (meth)acrylate and (meth)acrylonitrile monomers.
申请公布号 JP2000137327(A) 申请公布日期 2000.05.16
申请号 JP19990238542 申请日期 1999.08.25
申请人 SUMITOMO CHEM CO LTD 发明人 FUJISHIMA HIROAKI;KAMIYA YASUNORI;ARAKI KO
分类号 H01L21/027;G03F7/039 主分类号 H01L21/027
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