| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance electrical connection by forming an anisotropic conductor to be thicker than those of the combined a conductor part and a bump thicknesses, thereby preventing a semiconductor bare chip from being stripped from the anisotropic conductor. SOLUTION: An anisotropic conductive film 6 is pasted to the chip mounting region of a flexible wiring board 5, and a semiconductor bare chip 3 is arranged thereon and bonded by thermotempression. Conductive particles 8 are collapsed between a gold bump 7 formed on the electrode of the bare chip 3 and the conductor part 4 to connect them electrically, and an adhesive film 9 is hardened to keep the connected state through aggregation force thereof. Furthermore, the anisotropic conductive film 6 is formed thicker than that of the combined conductor part 4 and bump 7 thickness. When the anisotropic conductive film 6 is formed with such a thickness, the bare chip 3 is surely bonded to the wiring board 5, because a fillet 10 is formed on the side face of the bare chip 3.</p> |
