| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin encapsulation method for a chip size package which improves productivity and molding quality wherein voids are hardly generated. SOLUTION: In a resin encapsulation method of a chip size package which seals an object 3 to be molded with resin, wherein a semiconductor chip is bonded to a carrier tape on which a wiring pattern is formed, via an elastomer from a surface electrode forming surface, and the wiring pattern is electrically connected with a surface electrode, the semiconductor chip as the object 3 to be molded is accommodated in a cavity-recessed part of a metal mold 1, in which a release film 2 is stuck on a parting surface. While the carrier tape is clamped by the metal mold 1 as it is, sealing resin 11 is injected from a gate opened at a gap position formed between the cavity recessed part and the object 3 to be molded at a specified resin pressure, and resin encapsulation is performed. |
