| 摘要 |
PROBLEM TO BE SOLVED: To enable reducing the total load to be applied to a bonding tool and impairing of electrical connection between a semiconductor substrate and a bump electrode, when a load is applied locally to a polymerization part. SOLUTION: A semiconductor pellet 1, on which a large number of bump electrodes 3 are almost arranged annular in shape in a rectangular shape, and a wiring board 4 on which a large number of pad electrodes 6 are formed are polymerized, while the bump electrodes 3 and the pad electrodes 6 are heated. On the surface facing the pellet 1 of a bonding tool 10 to which ultrasonic vibration is applied, a plurality of pressing parts are arranged corresponding to the respective groups formed by plurally dividing a polymerization part, on which the bump electrodes and the pad electrodes are polymerized.
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