发明名称 Wafer positioning method and apparatus
摘要 The peripheral edge of a wafer is cramped by four cramp rollers which are able to move forward and backward with respect to a reference point, and thereby, the center of the wafer is positioned at the reference point. Then, a notch pin, which is provided on a reference line, is pressed against the peripheral edge of the wafer, and the wafer is rotated about the reference point. Thereby, a notch on the wafer moves to the notch pin, and then, the notch pin fits into the notch. Thus, the wafer is positioned at a predetermined position.
申请公布号 US6062953(A) 申请公布日期 2000.05.16
申请号 US19980042803 申请日期 1998.03.17
申请人 TOKYO SEIMITSU CO., LTD. 发明人 TAKAYA, JUN;IKEDA, KAZUMI
分类号 B24B9/00;B23Q3/18;B25B5/14;H01L21/68;(IPC1-7):B24B1/00 主分类号 B24B9/00
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