INTERMEDIATE PRODUCT FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To suppress distortions and warpages on a flexible circuit board sheet by applying an adhesive to a part in the circumferential region of a frame opening above a carrier frame along two sides in the breadthwise direction of the frame which is superposed on the circuit board sheet after being pasted. SOLUTION: A flexible circuit board sheet 7 is pasted to the opening part of a metal frame 1, by applying an adhesive to a part in the circumferential region of the frame opening part above a frame 1 along two sides in the width direction thereof being superposed on the circuit board sheet 7 after being pasted. Since an intermediate product for semiconductor device is bonded using only two sides out of four sides of the frame opening part and stress is relaxed by two open sides, abrupt generation of strain in a limited range can be avoided and warpages the sheet can be reduced.