发明名称 |
Apparatus and method for face-to-face connection of a die face to a substrate with polymer electrodes |
摘要 |
An apparatus and method for face-down connection of a die to a substrate with polymer electrodes, the method comprising forming a plurality of conductive polymer electrodes on a substrate assembly; and elevating the temperature of the die sufficiently to cause electrical and fixed connection of the die to the electrodes upon appropriate contact; and then bringing the die face and electrodes into appropriate contact thereby forming the fixed and electrical connection.
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申请公布号 |
US6064120(A) |
申请公布日期 |
2000.05.16 |
申请号 |
US19970916983 |
申请日期 |
1997.08.21 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
COBBLEY, CHAD;JIANG, TONGBI |
分类号 |
H01L21/60;H05K3/32;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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