发明名称 Apparatus and method for face-to-face connection of a die face to a substrate with polymer electrodes
摘要 An apparatus and method for face-down connection of a die to a substrate with polymer electrodes, the method comprising forming a plurality of conductive polymer electrodes on a substrate assembly; and elevating the temperature of the die sufficiently to cause electrical and fixed connection of the die to the electrodes upon appropriate contact; and then bringing the die face and electrodes into appropriate contact thereby forming the fixed and electrical connection.
申请公布号 US6064120(A) 申请公布日期 2000.05.16
申请号 US19970916983 申请日期 1997.08.21
申请人 MICRON TECHNOLOGY, INC. 发明人 COBBLEY, CHAD;JIANG, TONGBI
分类号 H01L21/60;H05K3/32;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 主分类号 H01L21/60
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