发明名称 HEAT DISSIPATION CLIP
摘要 PROBLEM TO BE SOLVED: To reduce the labor required for assembling work by removing an anti-tilt arrangement by providing the foot part with a protrusion locking on the backside of a printed wiring board to secure the foot part in fitted state in a through hole. SOLUTION: Foot 6 of a heat dissipation clip 5 abuts, at the protrusion 7 thereof, against the through hole 2 in a printed wiring board 1. Consequently, the foot part 6 having a center line shifted from that of the through hole 2 flexes to the central side thereof. When the foot part 6 is inserted farther under that state, the protrusion 7 projects to the backside of the printed wiring board 1 through the through hole 2. Since the protrusion 7 is released from the through hole 2, the foot part 6 is reset to unflexed state by the resetting force of its own material. Consequently, the protrusion 7 engages the backside of the printed wiring board 1 to secure the foot part 6 in a state of being fitted in the through hole 2. Since a mechanical securing force can be imparted to engagement of the foot part 6 and the through hole 2, mounting state of the heat dissipation clip 5 can be held even before soldering process.
申请公布号 JP2000138476(A) 申请公布日期 2000.05.16
申请号 JP19980309015 申请日期 1998.10.29
申请人 OKI ELECTRIC IND CO LTD 发明人 MIYAGISHIMA KANAME
分类号 H05K7/12;(IPC1-7):H05K7/12 主分类号 H05K7/12
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