发明名称 |
Wafer polishing head drive |
摘要 |
A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head drive housing for pivoting the head drive housing and the head portion from the horizontal orientation to a vertical orientation juxtaposed to a transverse vertical portion of a continuous rotating polishing belt; a drive in the housing for moving the head portion and a mounted wafer outwardly from the housing against the transverse vertical portion of the rotating polishing belt; and a drive in the housing for rotating the head portion and the mounted wafer. The head drive housing may be pivoted from the vertical orientation in a sweeping arc extending perpendicularly from the belt transverse vertical portion or in a swinging arc extending parallel from the belt transverse vertical portion. The pivot mechanism includes a hollow shaft connected to said head drive housing; and a motor, gearbox and a ball screw and nut assembly in driving connection between the gearbox and the hollow shaft for transversing in a direction parallel to the belt.
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申请公布号 |
US6062961(A) |
申请公布日期 |
2000.05.16 |
申请号 |
US19970964817 |
申请日期 |
1997.11.05 |
申请人 |
APLEX, INC. |
发明人 |
CAN, LINH X.;LUM, KELVIN;APPEL, GREGORY A. |
分类号 |
B24B21/04;B24B37/04;(IPC1-7):B24B41/06 |
主分类号 |
B24B21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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