| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate having the coefficient of thermal expansion near to IC and excellent in mechanical physical properties, dimensional stability, surface properties, heat resistance and electric characteristics, and a method for producing the same. SOLUTION: A laminate consists of a heat-resistant film and a polyimide resin mutually bonded in bonding strength of 0.5 kg/cm or more and the coefficient of thermal expansion thereof is 0-40 ppm/ deg.C. The laminate is produced by laminating or applying a polyimide resin and/or polyamide acid containing 0.01-500 wt.% of a solvent to a surface-treated heat-resistant film and heat- treating the whole.
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