ROLLER OF SEMICONDUCTOR APPARATUS FOR GRINDING PROCESS

摘要

PURPOSE: A semiconductor device for a grinding process is provided to grind the whole face of a wafer in a regular thickness on CMP(chemical mechanical polishing) process for the wafer. CONSTITUTION: A roller(12) of a semiconductor device is installed on a wafer(10). Then, the grinding radius on the wafer is changeable depending on the size and number of the rollers and the roller is in a state of an air cushion(16) for preventing the surface of the wafer from being damaged directly. The air cushion is any one shape between one whole air-tube shape and shape of filled with many air balls. The life span of the roller frictional face is expanded since the degree that the rotating face abrades the surface of the roller is the same. The roller comprises a roller shaft(14), a bearing (16) and an air cushion(14).