| 摘要 |
PURPOSE: A separating and cleaning apparatus is to prevent damage of a semiconductor chip during a direct heating of the chip by heating a soldering part of the chip with a substrate heating process and to increase an efficiency of cleaning work. CONSTITUTION: Heating of a substrate twice by a heating device(10) melts solder of a lead frame. Then, a semiconductor chip is separated from the heated substrate by an absorbing device(20). An applying device(30) applies a soldering assistant on a surface of the lead frame to remove remaining soldering impurities from the lead frame of the semiconductor chip. The heated semiconductor chip is cooled to a predetermined temperature by a cooling device(40). A cleaning device(50) sprays a cleaning fluid to remove the impurities stuck to the chip. A drier(60) sprays a warm airflow to remove the remaining cleaning fluid on the chip. After the impurities are removed, a sufficiently dried semiconductor chip is wrapped up in vacuum by an encapsulating device(70).
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