| 摘要 |
PURPOSE: A wafer unloading system used in a chemical-mechanical polishing apparatus is provided to shorten a wafer sensor locating time by installing a wafer detecting sensor within a gripper for gripping the wafer. CONSTITUTION: A wafer unloading system used in a chemical-mechanical polishing apparatus includes a flipper body on which wafers are stacked. Two flipper projections are projected from the flipper body and at least two grippers(220) are mounted on the flipper projections. The gripper(220) is provided at its top center with a groove. A wafer sensor is mounted on a portion of the top of the gripper when the groove is not formed. As the wafer sensor is mounted on the gripper(220), a wafer sensor locating time is not spent.
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