| 摘要 |
PURPOSE: A method and an apparatus for marking a chip size package are provided to improve a marking speed and a marking accuracy by performing a direct marking on a wafer before cutting a wafer. CONSTITUTION: A method for marking a chip size package comprises the steps of: marking a name or a trademark of a company on a wafer(1) before cutting a wafer; cutting the wafer to be divided into each chips; adhering the divided chips to a plastic IC tape; and performing a beam lead bonding process and a capsulization process. An apparatus for marking a chip size package comprises an on-loading device(10), a guide rail(20), a pattern vis ion (22), a marking device(24), a transferring device(21), a marking vis ion (26), and an off-loading device(30).
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