| 摘要 |
The present invention refers to a method when manufacturing a circuit board (10), specially a multilayer circuit board (10). The method is provided to protect a surface coating of a cavity (11) by preventing harmful production material floating into the cavity through one or more via holes (13, 13') arranged in said cavity (11), said cavity being arranged for receiving an electric component. The via holes during the production of at least each layer of said circuit board are filled with an agent, resistant to said harmful material and also resistant to subsequent soldering. |
