发明名称 |
METHOD FOR FORMING METAL WIRES OF SEMICONDUCTOR DEVICES |
摘要 |
PURPOSE: A metal wire formation method is provided to simplify manufacturing process and improve a yield by simultaneously forming the metal wire and a contact hole using a liquefied oxide layer. CONSTITUTION: An oxide layer for isolating between conductive layers(23) is formed on a lower layer(21). By etching the oxide layer, an oxide pattern(26) having a contact hole is formed, and then a photoresist pattern is formed to fill the contact hole. By performing oxidation process, a liquefied oxide layer(29) is grown only on the oxide pattern(26). After removing the photoresist pattern, a barrier metal and a metal wire is formed.
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申请公布号 |
KR20000027631(A) |
申请公布日期 |
2000.05.15 |
申请号 |
KR19980045586 |
申请日期 |
1998.10.28 |
申请人 |
HYUNDAI ELECTRONICS IND. CO., LTD. |
发明人 |
JEON, BAE GEUN;YOU, EUI GYU |
分类号 |
H01L21/28;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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