发明名称 METHOD FOR FORMING METAL WIRES OF SEMICONDUCTOR DEVICES
摘要 PURPOSE: A metal wire formation method is provided to simplify manufacturing process and improve a yield by simultaneously forming the metal wire and a contact hole using a liquefied oxide layer. CONSTITUTION: An oxide layer for isolating between conductive layers(23) is formed on a lower layer(21). By etching the oxide layer, an oxide pattern(26) having a contact hole is formed, and then a photoresist pattern is formed to fill the contact hole. By performing oxidation process, a liquefied oxide layer(29) is grown only on the oxide pattern(26). After removing the photoresist pattern, a barrier metal and a metal wire is formed.
申请公布号 KR20000027631(A) 申请公布日期 2000.05.15
申请号 KR19980045586 申请日期 1998.10.28
申请人 HYUNDAI ELECTRONICS IND. CO., LTD. 发明人 JEON, BAE GEUN;YOU, EUI GYU
分类号 H01L21/28;(IPC1-7):H01L21/28 主分类号 H01L21/28
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