METHOD FOR BONDING SPIRAL INDUCTOR HAVING HIGH QUALITY FACTOR BY USING FLIP CHIP BONDING

摘要

PURPOSE: A method for bonding a spiral inductor is provided to increase a quality factor without changing the manufacturing process by using a flip chip bonding. CONSTITUTION: A method for bonding a spiral inductor comprises the steps of: separating an inductor chip from a pattern composed of a circuit and the inductor chip; engraving a predetermined portion on a printed circuit board so that the inductor chip can be inserted to the engraved portion; and inserting the inductor chip into the engraved portion to be connected to the circuit and the printed circuit board.