| 摘要 |
PURPOSE: A sensitive liquid of wafer cleaning method is provided to effectively reduce the defect of wafer due to the temperature difference between a cooling plate and a wafer and to enhance the cooling effect of the wafer by dispersing the cooling air. CONSTITUTION: A system comprises a wafer(10, 20, 30), a cooler plate(12, 22, 32), a pin(14, 24, 34), a process cooling water supply conduct(16), a cooling air supply conduct(35), a screw(36), a pin bearing (38), and an air cylinder(40). A method comprises a step of loading the wafer to the left station; a step of sequentially loading the wafer which is loaded to the left station into the chamber; a step of carrying out the cleaning to eliminate the sensitive liquid smeared at the wafer; a step of unloading the wafer which is inside the chamber; and a step of cooling the unloaded wafer by loading it to the cooler stage. The method further comprises a step of unloading the wafer at the cooler stage and a step of unloading the wafer at the cooler stage to the cassette of the right station.
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